E21-400G37S_Other_SPI/SOC/UART_Module_Fabricants de modems sans fil Lora en Chine, fournisseurs de terminaux IoT industriels

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E200-900A17S Amplificateur de puissance à Gain RF E21-400G37S, Module d'amplificateur de puissance RF sans fil haute puissance

[Bande de fréquence de travail]：410 ~ 493 MHz.

[Puissance de transmission]： 37 dBm

[Distance de communication]： 20 km

[Gain de réception]： 15 dBm

[Taille du produit]： 45 x 30 mm.

[Introduction]：E21-400G37S est un amplificateur de puissance moyenne (PA) RF purement matériel lancé par Chengdu Ebyte Company, avec une puissance de sortie maximale de 37 dBm, couvrant une plage de fréquences de 410 à 493 MHz, et un amplificateur LNA à faible bruit intégré dans le module, ce qui améliore considérablement la communication sans fil. distance de communication.

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PIN	Name	Direction	Usage
1	GND		Ground wire, connected to reference ground
2	+7. 5V		PA drive power VCC1
3	+7. 5V		PA drive power VCC1
4	GND		Ground wire, connected to reference ground
5	+5V		Control power supply VCC2
6	GND		Ground wire, connected to reference ground
7	TXEN	Input	Enable the transmission mode, effective at high level (support 3. 3V/5V level)
8	RXEN	Input	Receive mode enable, active at high level (support 3. 3V/5V level)
9	GND		Ground wire, connected to reference ground
10	PIN	Input/Output	Transmission mode: RF signal input/reception mode: RF signal output
11	POUT	Output/Input	Transmission mode: RF signal output/reception mode: RF signal input
12	GND		Ground wire, connected to reference ground
13	GND		Ground wire, connected to reference ground
14	GND		Ground wire, connected to reference ground
15	GND		Ground wire, connected to reference ground
16	GND		Ground wire, connected to reference ground
17	GND		Bottom heat dissipation pad, connecting module GND
Note: 1. TXEN and RXEN cannot be opened at the same time at any time, which may cause direct damage to PA module. 2. The bottom bonding pad is connected to the internal GND, which needs to be coated with silicone grease for heat dissipation or welded to the base plate to enhance heat dissipation.

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